Electronic Device Business

Power Semiconductor
DCB & AMB Substrates

Application of Thermo-electric module Manufacturing Technology for Heat Dissipation and Insulation Substrate

Generally, organic and metal substrates are used in the circuit boards of low-power home appliances and computers.
However, alumina, aluminum nitride and silicon nitride substrates are used in heat radiation insulated substrates of power modules that handle high power.
In particular, silicon nitride substrates are attracting attention for use in power modules of inverters and converters because of the increase in sales of HEVs and EVs.
In response to this, we have started mass production of AMB (Active Metal Brazing) substrate as a new product, in addition to the DCB (Direct Copper Bonding) substrate that we have been producing.
Further development of the product is expected to contribute to miniaturization and energy saving.

DCB Direct Copper Bonding

DCB Substrate properties
Material
ZTA Ceramic
Item
Content
Thickness
Density
Thermal Conductivity
Bending Strength
Dielectric Constant
Dielectric Loss
Dielectric Strength
Electrical Resistivity
Value
90% Al / ZrO₂
0.32, 0.25
3.95
27
600
10.5
0.0003
20
1*1014
Unit
%
mm
g/cm³
W/m.k
Mpa
1MHz
1MHz
kV/mm
Ωcm
Al2O3 Ceramic
Content
Thickness
Density
Thermal Conductivity
Bending Strength
Dielectric Constant
Dielectric Loss
Dielectric Strength
Electrical Resistivity
96% Al₂O₃
1.00,0.89,0.76,0.63,
0.5,0.38,0.32,0.25
3.73
24
350~450
9.8
0.0003
20
1*1014
%
mm
g/cm³
W/m.k
Mpa
1MHz
1MHz
kV/mm
Ωcm
Copper
Material
Purity
Hardness
Electrical Conductivity
Copper Thickness
OFHC
99.99
90~110
58.6
0.40,0.30,0.25,
0.20,0.127
 
%
HV
MS/m
mm
DCB Substrate
Master Card Size(Max)
Max.Useable area(Max)
Sacing between SOLDERMASK pattern(Min)
SOLDERMASK pattern width(Min)
Peeling Strength(Min)
Solderability
Delivery Term
Surface Options
138*190
127*178
Followed by design rule
+0.3/-0.2
>5
>95%
Single Pieces Delivery/Mastercard Delivery
Bare Copper/Solder Stop/Electronics Ni-Plating::2~8/Electroless NiAu-Plating::2~8&0.01~0.1/
Electroless Ag 0.1-0.6μm
mm
mm
mm
mm
N/mm
%
 
µm

AMB Active Metal Brazing

AMB Substrate properties
Material
SiN Ceramic
Item
SiN Content
Thickness
Density
Thermal Conductivity
Bending Strength
Dielectric Constant
Dielectric Loss
Dielectric Strength
Electrical Resistivity
Value
96% SiN
0.32, 0.25
3.22
A90
700
8
0.001
20
1*1014
Unit
%
mm
g/cm³
W/m.k
Mpa
1MHz
1MHz
kV/mm
Ωcm
AlN Ceramic
Content
Thickness
Density
Thermal Conductivity
Bending Strength
Dielectric Constant
Dielectric Loss
Dielectric Strength
Electrical Resistivity
96% AlN
1.0,0.63,0.38,0.25
3.3
170
350
9
0.0005
20
1*1014
%
mm
g/cm³
W/m.k
Mpa
1MHz
1MHz
kV/mm
Ωcm
Copper
Material
Purity
Hardness
Electrical Conductivity
Copper Thickness
OFHC
99.99
60~110
58.6
0.8,0.5,0.4,0.3,0.25,0.2
 
%
HV
MS/m
mm
AMB Substrate
Master Card Size(Max)
Max.Useable area(Max)
Sacing between SOLDERMASK pattern(Min)
SOLDERMASK pattern width(Min)
Peeling Strength(Min)
Solderability
Delivery Term
Surface Options
138*190
127*178
Followed by design rule
+0.3/-0.2
>10
>95%
Single Pieces Delivery/Mastercard Delivery
Bare Copper/Solder Stop/Electronics Ni-Plating::2~8/
Electroless NiAu-Plating:2~8&0.01~0.1/Electroless Ag 0.1-0.6μm
mm
mm
mm
mm
N/mm
%
 
µm
Business group of Power Semiconductor Substrates

FerroTec Shanghai

Shanghai Shanghai shenhe thermo-magnetics electronics Co.,Ltd.

Adress
181 Shanlian Road,Shanhai Baoshan City Industrial Zone 200444,P.R.China

Map

FerroTec Dongtai

Dongtai Ferrotec(JiangSu)Semiconductor Technology Co.,Ltd.

Adress
18# Hongda Road, Chengdong New Zone, Dongtai, Jiangsu, P.R. China

Map
Industries that use these technologies
Audio Automotive Electronics Medical Equipment Home Appliance Other Industries
The Equipment Related Business
Vacuum Seals  
 
 
Quartz Products  
 
 
Ceramics  
   
SiC Parts (CVD-SiC)  
 
Silicon Parts  
 
 
EB Components    
   
Vacuum Coating System    
   
Silicon Wafers    
     
Process Tools Parts Cleaning            
Electronic Device Business
Ferrofluid
Thermo-electric Modules  
 
Power Semiconductor Substrate  
 
Manufacturing Bases
Power Semiconductor Substrates Application Fields
  • Power transmission system

  • Electric train

  • Electric vehicle

  • Production equipment

  • Solar battery

  • Home appliance

  • Personal computer

  • Server machine


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