The Equipment Related BusinessEssential Devices in the Manufacturing Process

Vacuum Seals

Ensuring a Sealed Environment with no Contamination

The vacuum seals which use ferrofluid to enable transmission of rotational movement into the vacuum atmosphere are used in the manufacturing process of semiconductors, FPD, LED, and solar cells. They account for the company's core, and are used mainly in the etching and deposition processes of semiconductor wafers, as well as in the rotary mechanisms of delivery robots for FPD panels, isolating the sealed space from the outside, while precisely transmitting the necessary power for processing.

Please contact :
Ferrotec Europe GmbH
Mr. Joachim Schmied
Sales Representative
T: +49 7022 9270 202
E: jschmied@de.ferrotec.com

Industries that use these technologies
Audio Automotive Electronics Medical Equipment Home Appliance Other Industries
The Equipment Related Business
Vacuum Seals  
 
 
Quartz Products  
 
 
Ceramics  
   
SiC Parts (CVD-SiC)  
 
Silicon Parts  
 
 
EB Components    
   
Vacuum Coating System    
   
Silicon Wafers    
     
Process Tools Parts Cleaning            
Electronic Device Business
Ferrofluid
Thermo-electric Modules  
 
Power Electronic Substrate  
 
Manufacturing Bases
Case Examples of Vacuum Seal
  • Sputtering Device

    Sputtering is a dry plating method that does not expose the objects to be coated to liquid or heated gas. With applications in a variety of fields, it is an essential technology for the high quality membrane deposition required for semiconductors and FPD.

  • CVD Equipment

    CVD, or chemical vapor deposition, is one technique for making thin films. Gas containing components needed for different membranes are exposed to heated substrates, resulting in the deposition of a membrane by chemical reaction on the substrate surface.

  • Vacuum Robots

    In a clean environment, these are used to safely and accurately transport semiconductor wafers and FPD panels.

  • Ion Implantation Equipment

    Ion implantation is accelerating ionized atoms or molecules, and implanting them into a substrate to alter its properties. In semiconductor manufacturing, it is possible to provide electrical characteristics by implanting boron or phosphorus into silicon wafers.

  • Etching Equipment

    Etching is a surface processing method that uses the corrosive effect of a chemical solution or reactive gas. In semiconductor manufacturing it is used as a method to remove thin films in the patterning process of wafers. There is dry etching, which uses gas turned into plasma to accelerate ions to scrape away film by scientific reaction, and wet etching, which utilizes the corrosive effects of acid and alkali.

  • Epitaxial Growth System

    Epitaxial growth is the deposition of a uniform orientation crystalline overlayer on a crystalline substrate base. For next generation SiC and GaN power electronic substrates manufacturing, epitaxial growth is a vital technology.

  • Gas Introduction Machines

    It’s possible to introduce gas into a processing cell chamber by taking advantage of the sealing capabilities of the vacuum seal. We also have a track record of the multi-channel type.

  • Vacuum Chuck

    By using the vacuum’s suction force, this is a method of fixing wafers and glass substrate by adsorption. Fixation allows samples not to be damaged by high-speed rotation or transport.

  • Single Crystal Pulling Apparatus

    The apparatus for refining silicon ingot indispensable for the semiconductor and solar cell manufacturing. Vacuum seals are also employed in our company’s solar cell silicon pulling apparatus.

  • Vacuum Furnace and Pressurization Furnace

    Used for heat treatment for metal materials. A fan is attached to the axis of the vacuum seal, to help convection control of gas and temperature.


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